Nordson Integra 508.3 용접기 (1.5 ~ 12 KW; 1.5 ~ 8 KW)

Motion System: 

Z accuracy: ±100 μm (0.004 in.)

Z repeatability: (1) ±50 μm (0.002 in.), 3 sigma

Z velocity: 0.05 m/s peak (2 in./s)

X-Y accuracy: ±100 μm (0.004 in.)

X-Y repeatability: (1) ±50 μm (0.002 in.), 3 sigma

X-Y velocity: 0.2 m/s peak (8 in./s)

Computer: PC with Windows® operating system

Windows is a registered trademark of Microsoft Corporation in the United States and other countries.

Software: PhotoScan “point-and-click” programming editor and machine control software

Solder Pot Capacity and Weight:

Capacity: Approx. 12.0 kg (26.4 lbs.)

Total weight of tin-lead solder, solder pot, and pump assembly: Approx. 22.4 kg (49.2 lbs.)

Total weight of lead-free solder, solder pot, and pump assembly: Approx. 19.7 kg (43.3 lbs.)

Max. temperature: 320°C

Preheating:

Selectable topside preheating from 1.5 to 12 KW

Selectable bottom preheating from 1.5 to 8 KW

Solderable Area (X-Y): Single, parallel or double operating mode:

508.1 S: Max. 508 x 508 mm (20.0 x 20.0 in.)

508.1 Two-Segment: Max. 700 x 508 mm (27.6 x 20.0 in.)

Board Handling Capability: 

508.3 Two-Segment

Max. board size: 700 x 508 mm (27.6 x 20.0 in.)

Max. board size (2x boards): 350 x 508 mm (13.8 x 20.0 in.)

Min. board size: 50 x 50 mm (2.0 x 2.0 in.)

Conveyor:

Max. board/carrier length: 508 mm (20.0 in.), Two-Segment up to 700 mm (27.6 x 20.0 in.)

Min. board/carrier length: 50 mm (2.0 in.)

Max. board/carrier width: 508 mm (20.0 in.)

Min. board/carrier width: 50 mm (2.0 in.)

Max. board/carrier thickness: 15.2 mm (0.6 in.)

Max. overboard clearance: 120 mm (4.7 in.)

Max. underboard clearance: 40 mm (1.5 in.)

Edge clearance: 3 mm (0.12 in.), edge conveyor including on-rail clamps

Transport height: Conforms to SMEMA standard for conveyor height; height adjustable from 940-965 mm

(37.0 -38.0 in.) from the floor to bottom of the board.

Load capacity: 7.5 kg (16.5 lbs.)

Operation modes: Automatic (SMEMA), manual or pass-through