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Suneast WBD2200 PLUS IC Bonder

Placement accuracy: ±15um@3σ

Placement angle accuracy: ±0.3°@3σ

Force control range: 20-1000g(with different configurations,the maximum support is 7500g)

Force control accuracy: 20g-150g:±2g;   150g-1000g:±5%

Silicon wafer processing(mm): Max 12""(300mm), compatible with 8""(150mm)

Die size(mm): 0.25*0.25mm-10*10mm

Loading/Unloading: Manual/auto

Applicable material box(mm): L:110-310  W:20-110  H:70-153

Applicable lead frame(mm): L:100-300  W:38-100  H:0.1-0.8

Glue feeding mode: Dispensing+painting glue

Core module movement mode: Linear motor + grating scale

Bottom photo-taking: Option

Machine dimension(L×W×H): 2480mm×1470mm×1700mm

Weight: Approx.1800kg

*Remarks: Customization is supported



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