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Package: 208FBGA
Mounting: Surface Mount
Rad Hard: No
Pin Count: 208
Lead Finish: Tin-Lead
Chip Density: 1.8 Gbit
Memory Speed: 200 MHz
Organization: 128Mx72
Sub-Category: DDR2 SDRAM
Main Category: DRAM Module
Total Density: 1 GB
Data Bus Width: 72 Bit
Memory Density: 1 GB
Screening Level: Military
Supplier Package: FBGA
Chip Package Type: PBGA
Maximum Clock Rate: 400 MHz
Product Dimensions: 22.1 x 16.1 x 4.57 mm
Supply Voltage Max: 1.9 V
Supply Voltage Min: 1.7 V
Supply Voltage Nom: 1.8 V
Max Processing Temp: 225
Operating Temperature: -55 to 125 °C
Maximum Operating Current: 900 mA
Number of Chip per Module: 5
Operating Temperature Max: 125 °C
Operating Temperature Min: -55 °C
Maximum Random Access Time: 1.35 ns
Typical Operating Supply Voltage: 1.8000 V
