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NXP MF1SEP1031DUD/03V Secure Contactless Smart Card IC Wafer | EMIN.ASIA

Memory ICs
NXP MF1SEP1031DUD/03V Secure Contactless Smart Card IC Wafer

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NXP MF1SEP1031DUD/03V Secure Contactless Smart Card IC Wafer

ManufacturerNXP(View more products from this manufacturer)

ModelMF1SEP1031DUD/03V

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Type: Secure Contactless Smart Card IC

Package: Wafer

Category: Secure Contactless Smart Card IC

Mounting: Surface Mount

Rad Hard: No

Screening Level: Commercial

Supplier Package: WAFER

Operating Temperature: -25 to 70 °C

Operating Temperature Max: 70 °C

Operating Temperature Min: -25 °C

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