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Placement accuracy: ±15um@3σ
Placement anqle accuracy: ±0.1°@3σ
Wafer size(mm): 4"/6"/8"(Option：12")
Die size(mm): 0.25*0.25mm~10*10mm
Substrate size(mm): L150×W50~L300×W100
Substrate thickness(mm): 0.1~2mm
Placement head: 0-360°rotation/Auto change nozzle(option)
Placement pressure(N): 30~7500kg
Force control accuracy: 30g-250g:±10g; 250g-7500g:±5%
Glue feeding mode: Support：dispensing， dipping glue， painting glue
Core motion module: Linear motor+grating scale
Platform base of machine: Marble platform
Loading/unloading: Manual/auto
Machine dimension(L×W×H): 1255mm×1625mm×1610mm
*Remarks: Customization is supported
