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Pitch: 2.54mm
Width: 14.86mm
Height: 11.73mm
Length: 95.3mm
Feature: Mating Guide Cavity
Shape/Type: High Density(HDC|HDI|HPC)
Product type: ヘッダー
Mounting Type: Through Hole
Connector Type: Header|Male Pin
Terminal shape: Solder
Number of poles: 120
Housing material: Thermoplastic
Number of arrays: 4
Number of Columns: 30
Insulation Material: Black
Number of positions: 120
Contact point finish: Gold or GXT
Wire connection method: Solder
Contact Finish Thickness: 0.76um(30uinch)
Number of Positions Loaded: All
Wire connection method of the connector 1: Daughter Card
