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Pitch: 2.54 mm
Features: SOIC and SOJ-to-DIP adapter
Case Style: DIP
Row Spacing: 15.24 mm
Unit Weight: 5.716 g
Mounting Style: Through Hole
Number of Rows: 2 Row
Contact Plating: Tin
Contact Material: Brass Alloy
Termination Style: Solder Pin
Number of Positions: 28 Position
Maximum Operating Temperature: + 105 C
Minimum Operating Temperature: - 55 C
