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Pitch: 2.54 mm
Features: Converts PLCC Packaged ICs to DIP Footprints
Row Spacing: 15.24 mm
Unit Weight: 14.305 g
Mounting Style: PCB
Number of Rows: 2 Row
Contact Plating: Tin
Termination Style: Solder Tail
Number of Positions: 32 Position
Maximum Operating Temperature: + 105 C
Minimum Operating Temperature: - 55 C
