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Type: PGA|ZIF(ZIP)
Pitch: 2.54mm
Feature: Closed Frame
Terminal: Solder
Dielectric: Polyphenylene Sulfide(PPS)
Mounting Type: Through Hole
Contact point finish: Gold
Contact(Post) Finish: Tin
Contact Material (Post): Beryllium Copper
Contact Finish Thickness: 0.76um
Contact Material (Fitting): Beryllium Copper
Operating temperature range: -65 to 125C
