Bergquist 2166512 Thermal Pad GAP PAD, S-Class, GAP PAD TGP5000/5000S35, L16INW8INH0.04 SH | EMIN.ASIA

Thermal Interface
Bergquist 2166512 Thermal Pad GAP PAD, S-Class, GAP PAD TGP5000/5000S35, L16INW8INH0.04 SH

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Bergquist 2166512 Thermal Pad GAP PAD, S-Class, GAP PAD TGP5000/5000S35, L16INW8INH0.04 SH

Name: Bergquist 2166512 Thermal Pad GAP PAD, S-Class, GAP PAD TGP5000/5000S35, L16INW8INH0.04 SH
Brand: Bergquist

Model2166512

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Color: Light Green

Material: Silicone Polymer

Thickness: 1.016 mm

Designed for: VRMs, POLs, CDROM/DV ROM, PCB to Chassis, ASICs/DSPs, Memory Packages/Modules, Thermally Enhanced BGA's

Breakdown Voltage: 5 kVAC

Flammability Rating: UL 94 V-0

Thermal Conductivity: 5 W/m-K

Maximum Operating Temperature: + 200 C

Minimum Operating Temperature: - 60 C