Bergquist 2167530 Thermal Pad GAP PAD, Conformable, Ultra-Low Modulus, TGP3500ULM/3500ULM, L8INW16INH0.1 | EMIN.ASIA

Thermal Interface
Bergquist 2167530 Thermal Pad GAP PAD, Conformable, Ultra-Low Modulus, TGP3500ULM/3500ULM, L8INW16INH0.1

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Bergquist 2167530 Thermal Pad GAP PAD, Conformable, Ultra-Low Modulus, TGP3500ULM/3500ULM, L8INW16INH0.1

Name: Bergquist 2167530 Thermal Pad GAP PAD, Conformable, Ultra-Low Modulus, TGP3500ULM/3500ULM, L8INW16INH0.1
Brand: Bergquist

Model2167530

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Color: Gray

Material: Silicone Elastomer

Thickness: 2.54 mm

Designed for: Consumer Electronics, Telecommunications, ASICs and DSPs, PCs

Breakdown Voltage: 5 kVAC

Flammability Rating: UL 94 V-0

Thermal Conductivity: 3.5 W/m-K

Maximum Operating Temperature: + 200 C

Minimum Operating Temperature: - 60 C