Bergquist 2190890 Thermal Pad GAP PAD, S-Class, 1.575x1.575", TGP5000/5000S35 | EMIN.ASIA

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Bergquist 2190890 Thermal Pad GAP PAD, S-Class, 1.575x1.575", TGP5000/5000S35

Name: Bergquist 2190890 Thermal Pad GAP PAD, S-Class, 1.575x1.575", TGP5000/5000S35
Brand: Bergquist

Model2190890

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Size: 1.575 in x 1.575 in

Color: Light Green

Width: 40.005 mm

Length: 40.005 mm

Material: Silicone Polymer

Unit Weight: 16.292 g

Designed for: VRMs, POLs, CDROM/DV ROM, PCB to Chassis, ASICs/DSPs, Memory Packages/Modules, Thermally Enhanced BGA's

Breakdown Voltage: 5 kVAC

Flammability Rating: UL 94 V-0

Thermal Conductivity: 5 W/m-K

Maximum Operating Temperature: + 200 C

Minimum Operating Temperature: - 60 C