For full functionality of this site it is necessary to enable JavaScript.
EMIN.ASIA
0
Product image

Bergquist 2191376 Thermal Pad GAP PAD, S-Class, 0.440x0.630", TGP5000/5000S35

Contact
Secure Checkout
Quality Engagement
Easy change and return
Delivery Available

Size: 0.44 in x 0.63 in

Color: Light Green

Width: 11.176 mm

Length: 16.002 mm

Material: Silicone Polymer

Unit Weight: 323 mg

Designed for: VRMs, POLs, CDROM/DV ROM, PCB to Chassis, ASICs/DSPs, Memory Packages/Modules, Thermally Enhanced BGA's

Breakdown Voltage: 5 kVAC

Flammability Rating: UL 94 V-0

Thermal Conductivity: 5 W/m-K

Maximum Operating Temperature: + 200 C

Minimum Operating Temperature: - 60 C

Stay Updated with Offers

Get exclusive volume discounts, bulk pricing updates, and new product alerts delivered directly to your inbox.

By subscribing, you agree to our Terms of Service and Privacy Policy.

Quick Support

Direct access to our certified experts