Bergquist 2213719 Thermal Pad GAP PAD, S-Class, 0.020" Thickness, 3.543x0.787", TGP5000/5000S35 | EMIN.ASIA

Thermal Interface
Bergquist 2213719 Thermal Pad GAP PAD, S-Class, 0.020" Thickness, 3.543x0.787", TGP5000/5000S35

Stay Updated with Offers

Get exclusive volume discounts, bulk pricing updates, and new product alerts delivered directly to your inbox.

By subscribing, you agree to our Terms of Service and Privacy Policy.

Quick Support

Direct access to our certified experts

Bergquist 2213719 Thermal Pad GAP PAD, S-Class, 0.020" Thickness, 3.543x0.787", TGP5000/5000S35

Name: Bergquist 2213719 Thermal Pad GAP PAD, S-Class, 0.020" Thickness, 3.543x0.787", TGP5000/5000S35
Brand: Bergquist

Model2213719

Contact

Quantity

Secure Checkout

Quality Engagement

Easy change and return

Delivery Available

Size: 3.543 in x 0.787 in

Color: Light Green

Width: 89.9 mm

Length: 19.98 mm

Material: Silicone Polymer

Thickness: 0.508 mm

Unit Weight: 3.250 g

Designed for: VRMs, POLs, CDROM/DV ROM, PCB to Chassis, ASICs/DSPs, Memory Packages/Modules, Thermally Enhanced BGA's

Breakdown Voltage: 5 kVAC

Flammability Rating: UL 94 V-0

Thermal Conductivity: 5 W/m-K

Maximum Operating Temperature: + 200 C

Minimum Operating Temperature: - 60 C