Bergquist 2413730 Thermal Pad GAP PAD, High-Compliance, Low Modulus Material, 0.010" Thickness, 22.86x12.7mm | EMIN.ASIA

Thermal Interface
Bergquist 2413730 Thermal Pad GAP PAD, High-Compliance, Low Modulus Material, 0.010" Thickness, 22.86x12.7mm

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Bergquist 2413730 Thermal Pad GAP PAD, High-Compliance, Low Modulus Material, 0.010" Thickness, 22.86x12.7mm

Name: Bergquist 2413730 Thermal Pad GAP PAD, High-Compliance, Low Modulus Material, 0.010" Thickness, 22.86x12.7mm
Brand: Bergquist

Model2413730

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Size: 22.86 mm x 12.7 mm

Color: Blue

Width: 12.7 mm

Length: 22.86 mm

Material: Silicone Elastomer

Thickness: 0.254 mm

Unit Weight: 2.440 g

Designed for: Telecommunications, ASICs/DSPs, Consumer Electronics, Thermal Modules or Heat Sinks

Tensile Strength: 16 psi

Breakdown Voltage: 5 kVAC

Flammability Rating: UL 94 V-0

Thermal Conductivity: 3 W/m-K

Maximum Operating Temperature: + 200 C

Minimum Operating Temperature: - 60 C