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Boyd EA-190-H175-T710 Heat Sink Passive BGA/FPGA Extruded 45.2°C/W Aluminum/Plastic

Name: Boyd EA-190-H175-T710 Heat Sink Passive BGA/FPGA Extruded 45.2°C/W Aluminum/Plastic
Brand: Boyd

ModelEA-190-H175-T710

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Type: Passive

Material: Aluminum|Plastic

Fin Style: Extruded

Series Name: EA-190

Device Cooled: BGA|FPGA

Attachment Method: Clip

Product Dimensions: 19 x 19 x 17.5 mm

Thermal Resistance: 45.2 °C/W

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