Get exclusive volume discounts, bulk pricing updates, and new product alerts delivered directly to your inbox.
By subscribing, you agree to our Terms of Service and Privacy Policy.
Direct access to our certified experts
Pitch: 1 mm (0.039 in)
Data Rate: 25 Gbps
Unit Weight: 1.050 g
Stack Height: 1 mm
Current Rating: 1 A
Mounting Angle: Vertical
Number of Rows: 2 Row
Contact Plating: Gold
Contact Material: Copper Alloy
Housing Material: Liquid Crystal Polymer (LCP)
Maximum Data Rate: 25 Gbps
Termination Style: Solder
Number of Positions: 50 Position
Maximum Operating Temperature: + 125 C
Minimum Operating Temperature: - 55 C
