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Pitch: 0.8 mm (0.031 in)
Data Rate: 3 Gbps
Stack Height: 1 mm
Current Rating: 2.3 A
Mounting Angle: Vertical
Mounting Style: SMD/SMT
Number of Rows: 2 Row
Contact Plating: Gold
Contact Material: Copper Alloy
Housing Material: Liquid Crystal Polymer (LCP)
Maximum Data Rate: 3 Gbps
Termination Style: Solder
Flammability Rating: UL 94 V-0
Number of Positions: 100 Position
Maximum Operating Temperature: + 125 C
Minimum Operating Temperature: - 55 C
