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Special device for automated measurements on wafers ranging from 6 to 12 inches in diameter
Microfocus tubes with molybdenum anode as standard, tungsten anode optionally available
4-fold automatically exchangeable filter
Optimal local resolution; halo-free polycapillary optics enable measuring spots of 10 or 20 µm FWHM
Silicon drift detector for maximum precision on thin layers
Precise, programmable measuring stage with vacuum wafer chuck for automated measurements on small structures
Applications
Au/Pd/Ni/CuFe and Sn/Ni coatings in the micro- and nanometer range
Assembled and unassembled circuit boards
Testing of base metallization layers (under-bump metallization, UBM) in the nanometer range
Measurement of light elements, e.g. determination of the phosphorus content (in ENEIG/ENEPIG) under Au and Pd
Lead-free solder caps on copper pillars
Testing the elemental composition of C4 and smaller solder bumps, as well as small contact surfaces in the semiconductor industry
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