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Fully automated wafer handling and testing boost efficiency
XRF system with excellent detector sensitivity and high resolution
XRF system with polycapillary optics from the worldwide technology leader for measuring micro-spots
Accurately tests structures up to 10 µm in diameter
Automatic pattern recognition pinpoints the positions to be measured
Multiple operating modes; manual measurement possible whenever required
Flexible: docking station for FOUP, SMIF and cassette, for 6", 8" and 12" wafers
Applications
- Coating Thickness Measurement:
Base metallization layers (UBM) at the nanometer scale
Thin lead-free solder caps on copper pillars
Extremely small contact surfaces and other complex 2.5D / 3D packaging applications
- Material Analysis:
C4 and smaller solder bumps
Lead-free solder caps on copper pillars
Brochure
