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Description
PD 955 M is a thermosetting single component, solvent-free polymer adhesive, developed especially for the surface mounting of SMT components onto PCBs and for use on bare substrates. This rheology is specially adapted for high speed dispensing
Key Benefits
Very wide processing window, no tendency towards
stringing
Excellent adhesion with standard and also with
difficult to glue components
Consistent batch-to-batch quality
Applications
Dispensing
Physical Properties
Cleaning Instructions
Before curing: The adhesive can be removed with Zestron HC and other Zestron and Vigon cleaning materials.
Do not use alcohol as this will cure the adhesive. Cleaned dispensing units should be completely dried before installation.After Curing: Defective components can be replaced by heating (with hot air) the cured adhesive joint above
100 °C. After removing the component (torsion movement), the hot air should be focused on the remaining adhesive in order to remove it with a sharp toolAdhesive Conditioning.
Remove adhesive from fridge: Before opening the package leave it for at least 2 hours at room
temperature so that adhesive heats upDo not open cartridge while adhesive is cold to prevent condensation
Before using adhesive cartridge: Before inserting nozzle, press small quantity of glue out of cartridge
until homogeneous glue comes out – during storage of cartridges, low viscosity glue constituents may be found on the tip of the cartridge
