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Density: 512 MB
Package: 24TFBGA
Mounting: Surface Mount
Rad Hard: 0
Cell Type: NOR
MSL Level: MSL 3 - 168 hours
Pin Count: 24
Boot Block: Yes
Interfaces: 4-Wire, DTR, QPI, SPI
Access Time: 8.5 ns
ECC Support: No
Lead Finish: Tin-Silver-Copper
No. of Pins: 24
Architecture: Sectored
Interface Type: Serial-SPI
Memory Density: 512 Mbit
Number of Words: 64 MWords
Program Current: 28 mA
Screening Level: Extended Industrial
Supplier Package: TFBGA
Block Organization: Symmetrical
Maximum Erase Time: 270/Chip s
Product Dimensions: 6 x 8 x 0.84 mm
Supply Voltage Max: 3.6 V
Supply Voltage Min: 2.3 V
Supply Voltage Nom: 3, 3.3 V
Clock Frequency Max: 133 MHz
Max Processing Temp: 260 °C
Programming Voltage: 2.3 to 3.6 V
Operating Temperature: -40 to 105 °C
Location Of Boot Block: Bottom|Top
Number of Bits per Word: 8 Bit
Maximum Programming Time: 0.8/Page ms
Maximum Operating Current: 17 mA
Operating Temperature Max: 105 °C
Operating Temperature Min: -40 °C
Maximum Random Access Time: 6|7 ns
Simultaneous Read/Write Support: No
Typical Operating Supply Voltage: 2.5, 3.3 V
Erase Suspend/Resume Modes Support: Yes
