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Density: 256 Mbit
Package: 24TBGA
Mounting: Surface Mount
Rad Hard: No
Cell Type: NOR
Pin Count: 24
Boot Block: Yes
Interfaces: SPI
Access Time: 6 ns
ECC Support: No
Lead Finish: Tin-Silver-Copper
No. of Pins: 24
Architecture: Sectored
Interface Type: Serial-SPI
Memory Density: 256 Mbit
Number of Words: 256, 128, 64 MWords
Program Current: 60 mA
Screening Level: Automotive
Supplier Package: TBGA
Block Organization: Symmetrical
Maximum Erase Time: 1/Sector s
Product Dimensions: 6 x 8 x 0.79
Supply Voltage Max: 2 V
Supply Voltage Min: 1.7 V
Supply Voltage Nom: 1.8 V
Clock Frequency Max: 166 MHz
Max Processing Temp: 260
Programming Voltage: 1.7 to 2 V
Operating Temperature: -40 to 105 °C
Location Of Boot Block: Bottom|Top
Number of Bits per Word: 1, 2, 4 Bit
Maximum Programming Time: 2.8/Page ms
Maximum Operating Current: 22 mA
Operating Temperature Max: 105 °C
Operating Temperature Min: -40 °C
Maximum Random Access Time: 6 ns
Simultaneous Read/Write Support: No
Typical Operating Supply Voltage: 1.8000 V
Erase Suspend/Resume Modes Support: Yes
