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Molex 5023860671 Conn Wire to Board RCP 6 POS 1.25mm Solder RA SMD Emboss T/R

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Type: Wire to Board

Pitch: 1.2500 mm

Gender: Receptacle

Mounting: Surface Mount

Lead Finish: Gold over Nickel

Housing Color: Natural

Product Depth: 5

Number of Rows: 1

Product Height: 5.55

Product Length: 10.85

Contact Plating: Gold

Body Orientation: Right Angle

Contact Material: Copper Alloy

Number of Contacts: 6 POS

Product Dimensions: 10.85 x 5 x 5.55

Termination Method: Solder

Max Processing Temp: 245 °C

Base/Housing Material: Heat Resistant Resin

Operating Temperature: -40 to 105 °C

Maximum Contact Resistance: 20 mOhm

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