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Pitch: 0.35 mm (0.014 in)
Application: Board to Board
Unit Weight: 11.730 mg
Stack Height: 0.6 mm, 0.7 mm
Current Rating: 300 mA
Mounting Angle: Vertical
Mounting Style: SMD/SMT
Number of Rows: 2 Row
Voltage Rating: 50 V
Contact Plating: Gold
Contact Material: Copper
Housing Material: Liquid Crystal Polymer (LCP)
Termination Style: Solder
Flammability Rating: UL 94 V-0
Number of Positions: 48 Position
Maximum Operating Temperature: + 85 C
Minimum Operating Temperature: - 40 C
