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Package: 8SOIC
Mounting: Surface Mount
MSL Level: 1
Pin Count: 8
Input Type: Logic
Output Type: Push-Pull
Direction Type: Bi-Directional
Logic Gate Type: Buffer
Supplier Package: SOIC
Maximum Baud Rate: 15 Mbps
Maximum Fall Time: 1000 us
Maximum Rise Time: 6.5 ns
Typical Fall Time: 6.5 ns
Product Dimensions: 5.13 x 4.16 x 3.43 mm
Max Processing Temp: 245 °C
Operating Temperature: -40 to 110 to 110 °C
Maximum Power Dissipation: 60 mW
Number of Channels per Chip: 2
