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Dimensions: 517 (L) × 340 (W) × 380 (H) mm
Maximum board size: 350 (L) × 280 (W) mm
height: 200 mm
Fine adjustment height: 60 mm
Features:
1. The new modular work platform makes maintenance easier.
2. Simultaneous heating up and down, especially suitable for removing BGA and other chips that need to be preheated.
3. It can be adjusted according to the size of the board.
4. The function of the vacuum aspirating chip can be selected as needed.
Datasheet
