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Pitch: 0.8 mm (0.031 in)
Data Rate: 112 Gbps
Current Rating: 2.1 A, 9.6 A
Mounting Angle: Straight
Mounting Style: SMD/SMT
Number of Rows: 4 Row
Voltage Rating: 200 VAC
Contact Plating: Gold
Contact Material: Copper Alloy
Housing Material: Liquid Crystal Polymer (LCP)
Maximum Data Rate: 112 Gbps
Termination Style: Solder Balls
Number of Positions: 32 Position
Maximum Operating Temperature: + 125 C
Minimum Operating Temperature: - 55 C
