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Type: Card Edge
Pitch: 2.5400 mm
Mounting: Through Hole
MSL Level: MSL 1 - Unlimited
Lead Finish: Tin
Housing Color: Black
Card Thickness: 1.02 mm
Number of Rows: 1
Product Height: 7.9 mm
Contact Plating: Tin
Body Orientation: Straight
Contact Material: Beryllium Copper
Product Dimensions: 12.7 x 4.45 x 7.9 mm
Termination Method: Solder
Max Processing Temp: 260
Base/Housing Material: LCP (Liquid Crystal Polymer)
Operating Temperature: -55 to 105 °C
