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Pitch: 2 mm (0.079 in)
Data Rate: 8 Gbps
Stack Height: 6.35 mm
Current Rating: 5.2 A
Mounting Angle: Vertical
Mounting Style: Through Hole
Number of Rows: 2 Row
Contact Plating: Gold
Contact Material: Copper
Housing Material: Liquid Crystal Polymer (LCP)
Maximum Data Rate: 8 Gbps
Termination Style: Solder
Number of Positions: 24 Position
Maximum Operating Temperature: + 125 C
Minimum Operating Temperature: - 55 C
