Malcom RDT-165CP-A Reflow Oven (300℃, 0.3-0.5MPa)

Applicable Circuit Board: Up to 200Wx165Lx20H (Upper) 15H mm (Lower) mm

Outer Dimension: 460(W)×735(D)×1067(H) (mm) (Main Unit) 1327H (mm)  (w/signal tower)

Heating Method: 

Upper-face: Extreme infrared radiation with hot air

Lower-face: Extreme infrared radiation

Cooling Method: Underside cooling fan

Power Supply: 200V 50/60Hz 7kVA 3Phase

Air: by flowing air (with flow adjustable valve) 0.3-0.5MPa 100 liter/min (Maximum)

PCB Installation: Net system or Carrier system (Selectable on request)

Upper-Heater: extreme infrared radiation with hot air heater : 4.8kW (Approx.400W x 12 block) Adjustments can be made using the Matrix Heating System

Lower-Heater: Extreme infrared radiation heater : Approx. 1kW (500W x 2)

Temp. Range: Room temp. - 330C

Control: Exclusive softwarefor Windows 7/8.1/10

Weight: Approx. 85kg